E7 Pro系列Q170平臺 嵌入式工控機/車路協(xié)同控制器/邊緣計算控制器
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產(chǎn)品描述
阿普奇行業(yè)產(chǎn)品車路協(xié)同控制器E7 Pro系列Q170平臺是一款專為車路協(xié)同應(yīng)用而設(shè)計的嵌入式工控機，具有出色的穩(wěn)定性和兼容性。該控制器支持Intel? 6~9th Gen Core / Pentium/ Celeron Desktop CPU，采用LGA1700封裝，TDP為65W。搭配Intel? Q170芯片組，提供2個Intel千兆網(wǎng)絡(luò)接口，可實現(xiàn)高速、穩(wěn)定的網(wǎng)絡(luò)連接，滿足車路協(xié)同應(yīng)用中對網(wǎng)絡(luò)傳輸?shù)男枨蟆Ｅ鋫?個DDR4 SO-DIMM插槽，最大支持64GB內(nèi)存，為大數(shù)據(jù)處理和多任務(wù)操作提供了充足的內(nèi)存資源。在擴(kuò)展性方面，E7 Pro系列Q170平臺具備豐富的接口和擴(kuò)展功能，它提供4個DB9串口（COM1/2支持RS232/RS422/RS485），方便連接各種設(shè)備。同時支持M.2和2.5英寸硬盤位，提供多種存儲選擇，滿足數(shù)據(jù)存儲和備份的需求。支持4G/5G/WIFI/BT無線功能擴(kuò)展，提供穩(wěn)定的無線通信連接。可選PCIe/PCI標(biāo)準(zhǔn)擴(kuò)展槽位支持進(jìn)一步增強了控制器的擴(kuò)展能力。在顯示方面，E7 Pro系列Q170平臺具備3路顯示輸出，包括VGA、DVI-D和DP接口，最高支持4K@60Hz分辨率，為用戶帶來清晰、流暢的視覺體驗。采用DC18-60V寬壓輸入，額定功率可選600/800/1000W，滿足各種不同功耗的需求。
綜上所述，阿普奇行業(yè)產(chǎn)品車路協(xié)同控制器E7 Pro系列Q170平臺以卓越的性能、強大的穩(wěn)定性和易于組裝的特點，可為工業(yè)自動化、智能制造、智能交通以及智慧城市等領(lǐng)域用戶提供更加可靠、高效的支持，助力各行業(yè)實現(xiàn)數(shù)智化轉(zhuǎn)型和升級。
|
Model |
E7 Pro |
|
|
CPU |
CPU | Intel??6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU |
| TDP | 65W | |
| Socket | LGA1151 | |
| Chipset | Q170 | |
| BIOS | AMI UEFI BIOS (Support Watchdog Timer) | |
|
Memory |
Socket | 2 * Non-ECC U-DIMM Slot, Dual Channel DDR4 up to 2133MHz |
| Max Capacity | 64GB, Single Max. 32GB | |
|
Graphics |
Controller | Intel??HD Graphics |
|
Ethernet |
Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
|
Storage |
SATA | 3 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm),?Support?RAID?0, 1, 5 |
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
|
Expansion Slots |
PCIe Slot | ①: 2 * PCIe x16 (x8/x8) + 2 * PCI
②: 2 * PCIe x16 (x8/x8) + 1 * PCIe x4 (x4) PS: ①、②?One out of two, Expansion card length ≤ 320mm, TDP ≤ 450W |
| aDoor/MXM | 1 * aDoor Bus (Optional 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |
| Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, with 1 * SIM Card) | |
| M.2 | 1 * M.2 Key-B (PCIe x1 Gen 2 + USB3.0, with 1 * SIM Card, 3042/3052) | |
|
Front I/O |
Ethernet | 2 * RJ45 |
| USB | 6 * USB3.0 (Type-A, 5Gbps) | |
| Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz 1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
|
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) |
|
| Button | 1 * Power Button + Power LED 1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
|
|
Rear I/O |
Antenna | 6 * Antenna hole |
|
Internal I/O |
USB | 2 * USB2.0(wafer, Internal I/O) |
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | |
| TFront Panel | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | |
| Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | |
| Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |
| Serial | 2 * RS232 (COM5/6, wafer, 8x2pin, PHD2.0) | |
| GPIO | 1 * 16bit GPIO (wafer) | |
| LPC | 1 * LPC (wafer) | |
| SATA | 3 * SATA3.0 7P Connector | |
| SATA Power | 3 * SATA Power (SATA_PWR1/2/3, wafer) | |
| SIM | 2 * Nano SIM | |
| FAN | 2 * SYS FAN (wafer) | |
|
Power Supply |
Type | DC, AT/ATX |
| Power Input Voltage | 18~60VDC，P=600/800/1000W (Default 800W) | |
| Connector | 1 * 3Pin Connector, P=10.16 | |
| RTC Battery | CR2032 Coin Cell | |
|
OS Support |
Windows | 6/7th Core?: Windows 7/10/11
8/9th Core?: Windows 10/11 |
| Linux | Linux | |
|
Watchdog |
Output | System Reset |
| Interval | Programmable 1 ~ 255 sec | |
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC |
| Dimensions | 363mm(L) * 270mm(W) * 169mm(H) | |
| Weight | Net: 10.48 kg
Total: 11.38 kg (Include packaging) |
|
| Mounting | Wall mounted, Desktop | |
|
Environment |
Heat Dissipation System | Fanless Passive Cooling (CPU)
2 * 9cm PWM FAN (Internal) |
| Operating Temperature | -20~60℃?(Industrial SSD) | |
| Storage Temperature | -40~80℃?(Industrial SSD) | |
| Relative Humidity | 10 to 90% RH (non-condensing) | |
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |
| Certification | CCC, CE/FCC, RoHS | |
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E7 Pro系列Q170平臺 嵌入式工控機/車路協(xié)同控制器/邊緣計算控制器
